IEC Edition INTERNATIONAL. STANDARD. NORME. INTERNATIONALE. Electric components – Reliability – Reference conditions for . The following Chapter 3 explains failure rate prediction in detail based on the method of IEC Chapter 4 gives an outline of the observations of an EPSMA. 29 Jul The text of document 56//FDIS, future edition 2 of IEC , prepared by IEC TC This European Standard supersedes EN
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BS EN 61709:2017
Stress, Environment workingMathematical calculations, Semiconductor devices, Optoelectronic devices, Integrated circuits, Indicator lights, Relays, Diodes, Capacitors, Resistors, Transformers, Electric coils, Switches, Inductors, Reliability, Failure quality controlElectronic equipment and components. Valid Estimated date of Estonian translation publication: Shopping Cart Your shopping cart is empty. Take the smart route to manage medical device compliance.
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Search all products by. Conversion of failure rate data is only possible within the specified functional limits of the components. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with.
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Your basket is empty. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Worldwide Standards We can source any standard from anywhere in the world. This edition includes the following significant technical changes with respect to the previous edition: Reference conditions for failure rates and stress models for conversion. Reference conditions for failure rate data are specified, so that data from different sources lec be compared on a uniform basis.
Find Similar Items This product falls into the following categories. The prediction methodology described in this document assumes that the parts are being used within its useful life.
Click to learn more. This third edition is a merger of IEC The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach.
Accept and continue Learn more about the cookies we use and how to change your settings. This document does not provide base failure rates for components — rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition.
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The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications; Reference conditions are useful since they provide a ied standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions.
When failure rates stated at reference conditions are used it jec realistic reliability predictions to be made in the early design phase. You may experience issues viewing this site in Internet Explorer 9, 10 or This website is best viewed with browser version of up to Microsoft Internet Explorer 8 or Firefox 3.
Reference conditions for failure rates and stress models for conversion Status: The methods in this document have a general application but are specifically applied to a selection of component types as defined in 6179 6 to 20 and I.